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Agilent HSMx-C191 Low Profile ChipLED
Data Sheet
Description This series of ChipLEDs is designed with the smallest footprint to achieve high density of components on board. The HSMx-C191 has the industry standard 1.6 mm x 0.8 mm footprint. Its low 0.6 mm profile and wide viewing angle make this LED exceptional for backlighting applications. The available colors in this surface mount series are HER, orange, yellow, green, and AS AlGaAs red.
This package is fully binned by color and intensity, except for red color. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel. These packages are compatible with IR soldering process.
Features * Small size 1.6 mm x 0.8 mm x 0.6 mm * Industry standard footprint * Diffused optics * Operating temperature range of -30C to 85C * Available in 5 colors (HER, orange, yellow, green, AS AlGaAs red) * Compatible with IR solder reflow * Available in 8 mm tape on 7" diameter reel
Applications
* Keypad backlighting * Push button backlighting * LCD backlighting * Symbol indicator * Front panel indicator
Package Dimensions
LED DIE
CATHODE MARK
0.8 (0.031) 0.4 (0.016)
1.6 (0.063 )
1.0 (0.039) 0.3 (0.012) DIFFUSED EPOXY PC BOARD
POLARITY
0.6 (0.023) 0.3 (0.012) CATHODE LINE 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN.
SOLDERING TERMINAL
HSMx-C191
Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. 3. Polarity for HSMH-C191 will be the opposite of what is shown on above drawing.
Device Selection Guide Footprint (mm)[1,2] 1.6 x 0.8 x 0.6 HER HSMS-C191 Orange HSMD-C191 Yellow HSMY-C191 Green HSMG-C191 AS AlGaAs Red HSMH-C191 Package Description Untinted, Diffused
Notes: 1. Dimensions in mm. 2. Tolerance 0.1 mm unless otherwise noted.
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Absolute Maximum Ratings TA = 25C Parameter DC Forward Current[1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (I R = 100 A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature
Notes: 1. Derate linearly as shown in Figure 4. 2. Pulse condition of 1/10 duty and 0.1 msec width.
HSMS/HSMD/HSMY/HSMG-C191 20 100 52 5 95 -30 to +85 -40 to +85
HSMH-C191 25 100 65 5 95 -30 to +85 -40 to +85
Units mA mA mW V C C C
See IR soldering profile (Figure 6)
Electrical Characteristics TA = 25C Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 2.1 2.2 2.1 2.2 1.8 2.6 2.6 2.6 2.6 2.6 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 5 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 5 7 6 9 18 Thermal Resistance RJ-PIN = (C/W) Typ. 250 250 250 250 300
Part Number HSMS-C191 HSMD-C191 HSMY-C191 HSMG-C191 HSMH-C191
Color HER Orange Yellow Green AlGaAs
Optical Characteristics TA = 25C Luminous Intensity Iv (mcd) @ 20 mA[1] Min. Typ. 2.50 2.50 2.50 4.00 6.30 10.0 8.0 8.0 15.0 17.0 Peak Wavelength peak (nm) Typ. 630 605 589 570 660 Color, Dominant Wavelength d[2] (nm) Typ. 626 604 586 572 639 Viewing Angle 2 1/2 Degrees [3] Typ. 170 170 170 170 170
Part Number HSMS-C191 HSMD-C191 HSMY-C191 HSMG-C191 HSMH-C191
Color HER Orange Yellow Green AlGaAs
Notes: 1. The luminous intensity I v is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength d is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
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Color Bin Limits [1] Green Color Bins[1] Dom. Wavelength (nm) Bin ID Min. Max. A 561.5 564.5 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5
Tolerance: 0.5 nm
Yellow/Amber Color Bins[1] Dom. Wavelength (nm) Bin ID Min. Max. A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.0 E 592.0 594.5 F 594.5 597.0
Tolerance: 0.5 nm
Orange Color Bins[1] Dom. Wavelength (nm) Bin ID Min. Max. A 597.0 600.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 F 612.0 615.0
Tolerance: 1 nm
Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Bin ID Min. Max. A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50
Tolerance: 15%
Bin ID N P Q R S T U V W X Y
Intensity (mcd) Min. Max. 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00 715.00 1125.00 1125.00 1800.00 1800.00 2850.00 2850.00 4500.00
Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins.
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1.0 GREEN
RELATIVE INTENSITY
AlGaAs
YELLOW
0.5 ORANGE HER
0
500
550
600
650
700
750
WAVELENGTH - nm
Figure 1. Relative intensity vs. wavelength.
100
IF - FORWARD CURRENT - mA
LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
1.6 AlGaAs
HER AlGaAs GREEN
IF MAX. - MAXIMUM FORWARD CURRENT - mA
30
AlGaAs RED
25 20 15 10 5 0
HER, ORANGE, YELLOW, GREEN
1.2
10
600C/W
0.8
1 YELLOW 0.1 ORANGE 1.5 1.7 1.9 2.1 2.3
800C/W
0.4 GaP 0 0 10 20 30 40
0
20
40
60
80
100
VF - FORWARD VOLTAGE - V
IF - FORWARD CURRENT - mA
TA - AMBIENT TEMPERATURE - C
Figure 2. Forward current vs. forward voltage.
Figure 3. Luminous intensity vs. forward current.
Figure 4. Maximum forward current vs. ambient temperature.
1.00 0.90
RELATIVE INTENSITY
0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative intensity vs. angle for HSMx-C191.
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10 SEC. MAX.
TEMPERATURE
230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. 3C/SEC. MAX.
0.8 (0.031) 0.7 (0.028)
0.8 (0.031)
0.8 (0.031)
Figure 6. Recommended reflow soldering profile.
Figure 7. Recommended Soldering Pattern for HSMx-C191.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 8. Reeling orientation.
8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) O 20.20 MIN. (O 0.795 MIN.)
O 13.1 0.5 (O 0.516 0.020) 3.0 0.5 (0.118 0.020)
178.40 1.00 (7.024 0.039)
59.60 1.00 (2.346 0.039)
4.0 0.5 (0.157 0.020)
6 PS
5.0 0.5 (0.197 0.020)
Figure 9. Reel dimensions.
Note: All dimensions in millimeters (inches).
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4.00 (0.157) 1.50 (0.059)
CATHODE
DIM. C (SEE TABLE 1) 0.20 0.05 (0.008 0.002)
1.75 (0.069)
3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012)
DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.00 (0.157)
CARRIER TAPE USER FEED DIRECTION COVER TAPE
TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMx-C191 SERIES DIM. A DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) 1.80 (0.071) 0.95 (0.037) 0.75 (0.030)
Figure 10. Tape dimensions.
END
START
Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components.
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE.
Figure 11. Tape leader and trailer dimensions.
Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified.
Storage Condition: 5 to 30 C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/- 5C for 20 hours.
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For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright (c) 2002 Agilent Technologies, Inc. Obsoletes 5988-4831EN April 16, 2002 5988-6172EN

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